Ranging -- MSTAR
H. Steier and his colleagues at the University of Southern California are developing
high-speed and low-power-consumption electro-optic polymer modulator
chips that are used in the MSTAR setup. They are also pioneering
integration technologies that will enable compact and robust packaging
of optical and RF components.
Professor Harold Fetterman at UCLA is integrating
the optical modulator chips with RF drive components and packaging
them into usable modulator
units . UCLA is also working with USC on novel integration technologies
that will enable compact and robust packaging of optical and RF
Pacific Wave Industries has packaged the electro-optic
phase modulator chips provided by USC into high-speed RF modules
ready for system
integration into the JPL testbed.